During the international forum of the International Microelectronics Assembly and Packaging Society (IMAPS) at the 22nd Annual Device Packaging Conference (DPC), last March 3rd in Phoenix, AZ, USA, our colleague Frank Windrich (Fraunhofer IZM) presented “Integration routes for next‑generation 2.5D/3D wafer‑level system integration”. This topic represents one of the core technology pillars developed within the PREVAIL Project and it is a key enabler for advanced heterogeneous integration. Additionally, the conference offered in-depth discussions on topics such as heterogeneous integration (2D & 3D), fan-out, wafer-level and flip-chip packaging.
The event targeted a highly specialized audience from the fields of science, engineering and management, with the aim of discussing the latest technologies and market strategies in semiconductor packaging. Numerous networking opportunities and an evening panel discussion complemented the technical programme.
March 2-4, 2026
Phoenix, AZ, USA
