During the biggest international event of imec, ITF World 2026, the PREVAIL Project showcased its 3D demonstrator at the 3D system integration booth.
The exhibit featured a very special short-loop wafer: A short-loop silicon interposer-based integration platform enabling high density front and backside connectivity through TSVs. It combines advanced hybrid bonding and micro-bump technologies to stack multiple dies, showcasing scalable heterogeneous integration innovation.
It was a great opportunity to showcase progress and engage with the ecosystem!!
Learn more about the event here.
May 19-20, 2026
Antwerp, Belgium
