The aim of the PREVAIL project is to establish and start operating the core of a networked, multi-hub platform, providing prototype chip fabrication capabilities in advanced technology to EU stakeholders for Artificial Intelligence applications.
Our offering is based on three technological pillars: embedded Non-Volatile Memories (eNVM), 3D Integration Technologies (3D), and Photonics and Connectivity (SiPho&C). It includes the most promising technologies developed by the consortium partners to address the specifications required by edge AI chips.
We will be gradually disclosing and elaborating on relevant aspects of our comprehensive technical offer.
PREVAIL project partners
PREVAIL
A multi-hub Test and Experimentation Facility for edge AI hardware
Grant Agreement No. 101083307