Events
LID World Summit 2026
What about? Discover sustainable semiconductor breakthroughs to guide your roadmap from lab to market and to tomorrow’s AI factory at LID World Summit 2026. Join
June 12, 2026
Prototyping in advanced technologies and test services for AI applications.
The PREVAIL project is establishing and launching the core of a networked, multi-hub platform that provides prototype chip design and fabrication capabilities in advanced technologies to EU stakeholders for Artificial Intelligence applications. PREVAIL is an EU-funded project supported by the Digital Europe Programme.
Our consortium brings together four leading European Research and Technology Organizations (RTOs): CEA-Leti, imec, Fraunhofer, and VTT. Together, and in a coordinated and complementary fashion, we strengthen our advanced 300 mm fabrication, design, and test facilities to create a new multi-hub Test and Experimentation Facility for Edge AI Hardware.
PREVAIL enables trusted European infrastructure in which companies and research institutions can access cut-off technologies and innovative multi-hub process flows to design and fabricate early prototype samples, and to test them in real edge AI applications. The technologies included in our offer are among the most promising developed by the consortium partners to address the specifications required by edge AI chips:
Non-Volatile Embedded Memories
Due to their maturity level and impact on AI, the first set of technologies is dedicated to the implementation of resistive embedded Non-Volatile Memories on CMOS base wafers. Our portfolio provides users with access to advanced technologies for Magnetoresistive Random Access Memory (MRAM), Oxide-based RAM (OxRAM), and Ferroelectric RAMs (FeRAM).
3D Integration
The integration of heterogeneous parts using 3D and advanced packaging technologies is a key to future system scaling. In a high-performance, low-power system, various functions (computing, memory, caches, IO) are each realized in an optimized technology and integrated with 3D/advanced packaging. The PREVAIL offer includes various interconnect technologies, such as interposer, die to wafer, wafer to wafer, and Through-Silicon Via (TSV).
Demonstrators
To showcase the technology modules enhanced and multi-site process flows developed within the project, PREVAIL has selected three key AI use cases for the design and fabrication of corresponding demonstrators:
What about? Discover sustainable semiconductor breakthroughs to guide your roadmap from lab to market and to tomorrow’s AI factory at LID World Summit 2026. Join
As part of its ongoing collaboration and dissemination efforts, the PREVAIL Project was showcased this week by the NanoIC project at the European Materials Research
During the biggest international event of imec, ITF World 2026, the PREVAIL Project showcased its 3D demonstrator at the 3D system integration booth. The exhibit
