News
PRESS RELEASE
In this PRESS RELEASE, the consortium members share news about the goals and key components of this networked, multi-hub platform for edge AI chips fabrication.
February 27, 2024
Prototyping in advanced technologies and test services for AI applications.
The PREVAIL project will establish and start operating the core of a networked, multi-hub platform providing prototype chip fabrication capability in advanced technology to EU stakeholders for Artificial Intelligence applications. PREVAIL is supported by the Digital European Programme.
Our consortium includes four major European RTOs: CEA-Leti, imec, Fraunhofer, and VTT. We will build on our advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion to create a new multi-hub Test and Experimentation Facility for edge AI Hardware.
PREVAIL will enable a trusted infrastructure in Europe where companies and research institutions will be able to fabricate early prototype samples based on innovative technologies and test them in real edge AI applications. Our offer will include the most promising technologies developed by the consortium partners to address the specifications required by edge AI chips:
Non-Volatile Embedded Memories
Due to their maturity level and impact on AI, the first set of technologies is dedicated to the implementation of resistive embedded non-volatile memories on CMOS base wafers. Our portfolio will provide users with access to advanced technologies for Magnetoresistive Random Access Memory (MRAM), Oxide-based RAM (OxRAM), and Ferroelectric RAM (FeRAM).
3D Integration
The integration of heterogeneous parts using 3D and advanced packaging technologies is a key to future system scaling. In a high-performance, low-power system, various functions (computing, memory, caches, IO) are each realized in an optimized technology and integrated with 3D/advanced packaging. The PREVAIL offer will include various interconnect technologies, such as interposer, die to wafer, wafer to wafer, and Through-Silicon Via (TSV).
Photonics and Connectivity
In recent years, state-of-the-art Photonics Integrated Circuits (PICs) have enabled ultrafast artificial neural networks, offering an enhancement in computational speed and power efficiency. In PREVAIL, the consortium partners hold a world-leading position in this field proposing cutting-edge PIC processes. Moreover, the project will provide a state-of-the-art connectivity testbed to enable the validation of edge AI chip-based solutions with the latest mobile communication technologies.
In this PRESS RELEASE, the consortium members share news about the goals and key components of this networked, multi-hub platform for edge AI chips fabrication.
The PREVAIL consortium gathered at imec on January 30th and 31st, 2024, to discuss the progress of the project and technology offer. Representatives of the
EEAI 2023 – European Conference on EDGE AI Technologies and Applications.
October 17-19, 2023
Athens, Greece
PREVAIL project partners
PREVAIL
A multi-hub Test and Experimentation Facility for edge AI hardware
