News
LID World Summit 2025
June 17–19, 2025 The PREVAIL project proudly participated as a sponsor at the LID World Summit 2025, held in Grenoble, France. Throughout the three-day event, PREVAIL hosted a
June 17, 2025
Prototyping in advanced technologies and test services for AI applications.
The PREVAIL project will establish and start operating the core of a networked, multi-hub platform providing prototype chip fabrication capability in advanced technology to EU stakeholders for Artificial Intelligence applications. PREVAIL is supported by the Digital European Programme.
Our consortium includes four major European RTOs: CEA-Leti, imec, Fraunhofer, and VTT. We will build on our advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion to create a new multi-hub Test and Experimentation Facility for edge AI Hardware.
PREVAIL will enable a trusted infrastructure in Europe where companies and research institutions will be able to fabricate early prototype samples based on innovative technologies and test them in real edge AI applications. Our offer will include the most promising technologies developed by the consortium partners to address the specifications required by edge AI chips:
Non-Volatile Embedded Memories
Due to their maturity level and impact on AI, the first set of technologies is dedicated to the implementation of resistive embedded non-volatile memories on CMOS base wafers. Our portfolio will provide users with access to advanced technologies for Magnetoresistive Random Access Memory (MRAM), Oxide-based RAM (OxRAM), and Ferroelectric RAM (FeRAM).
3D Integration
The integration of heterogeneous parts using 3D and advanced packaging technologies is a key to future system scaling. In a high-performance, low-power system, various functions (computing, memory, caches, IO) are each realized in an optimized technology and integrated with 3D/advanced packaging. The PREVAIL offer will include various interconnect technologies, such as interposer, die to wafer, wafer to wafer, and Through-Silicon Via (TSV).
June 17–19, 2025 The PREVAIL project proudly participated as a sponsor at the LID World Summit 2025, held in Grenoble, France. Throughout the three-day event, PREVAIL hosted a
June 6, 2025 On the third day of the EPOSS Annual Forum 2025, held in Neu Châtel, Switzerland, the session titled “Edge AI and Cybersecurity Empowering European Sovereignty” featured
WEBINAR PREVAIL: Opening Access to Test Facilities for Edge AI Hardware Design and Fabrication June 6, 2025, 11:00–12:00 CET Hosted by CEA-Leti Registration: https://app.livestorm.co/cea-10/prevail-webinar The PREVAIL
PREVAIL project partners
PREVAIL
A multi-hub Test and Experimentation Facility for edge AI hardware
Grant Agreement No. 101083307
