The Fraunhofer EMFT team showcased their latest advances in flexible electronics at the LOPEC trade fair in Munich on February 25–26.
A key highlight was the newest addition to the Fraunhofer EMFT pilot line for flexible electronics: a high‑precision bonder for chip‑to‑foil integration. This tool enables the embedding of thinned microprocessors into ultra‑thin film packages below 150 μm, opening the door to highly flexible IC packages ideal for edge‑AI applications, including sensor systems that can be comfortably worn on the human body.
Funded through the PREVAIL Project, this new bonder strengthens Europe’s multi‑hub Test and Experimentation Facilities for next‑generation edge‑AI hardware.!! 🚀
“LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading international event for printed electronics. The combination of an exhibition and a conference is the perfect way to depict the complex and dynamic nature of this young industry. LOPEC is organized jointly by the OE-A (Organic and Printed Electronics Association) and Messe München GmbH.”
February 25-26, 2026
Munich, Germany
