LOPEC 2026
The Fraunhofer EMFT team showcased their latest advances in flexible electronics at the LOPEC trade fair in Munich on February 25–26. A key highlight was the newest addition to the Fraunhofer EMFT pilot line for flexible electronics: a high‑precision bonder for chip‑to‑foil integration. This tool enables the embedding of thinned microprocessors into ultra‑thin film packages […]
