22nd Annual Device Packaging Conference – International Microelectronics Assembly and Packaging Society
During the international forum of the International Microelectronics Assembly and Packaging Society (IMAPS) at the 22nd Annual Device Packaging Conference (DPC), last March 3rd in Phoenix, AZ, USA, our colleague Frank Windrich (Fraunhofer IZM) presented “Integration routes for next‑generation 2.5D/3D wafer‑level system integration”. This topic represents one of the core technology pillars developed within the […]
