October 7-9, 2025 – Phoenix AZ, USA
Our consortium partners Fraunhofer IZM and the Fraunhofer Institute for Photonic Microsystems IPMS were present at the German Pavilion at SEMICON WEST 2025. Among several key advancements, our colleagues Manuela Junghandel, Martin Landgraf, and Frank Windrich highlighted the latest developments in advanced packaging – particularly our 200 mm and 300 mm wafer‑level system‑integration capabilities, as well as their contributions to the EU project PREVAIL and the APECS pilot line.
Important discussions also took place between Luc Van den hove (current CEO of imec) and Stephan Guttowski (Head of Research at Fab Microelectronics Germany, FMD) regarding the future of packaging technologies in Europe.
