22nd Annual Device Packaging Conference – International Microelectronics Assembly and Packaging Society
During the international forum of the International Microelectronics Assembly and Packaging Society (IMAPS) at the 22nd Annual Device Packaging Conference (DPC), last March 3rd in Phoenix, AZ, USA, our colleague Frank Windrich (Fraunhofer IZM) presented “Integration routes for next‑generation 2.5D/3D wafer‑level system integration”. This topic represents one of the core technology pillars developed within the […]
LOPEC 2026
The Fraunhofer EMFT team showcased their latest advances in flexible electronics at the LOPEC trade fair in Munich on February 25–26. A key highlight was the newest addition to the Fraunhofer EMFT pilot line for flexible electronics: a high‑precision bonder for chip‑to‑foil integration. This tool enables the embedding of thinned microprocessors into ultra‑thin film packages […]
14th EUROPRACTICE Photonic Integrated Circuit Training
February 24-26, 2026 – Leuven, Belgium Alongside several leading projects and companies, imec’s Silicon Photonics experts deliver an in-depth technology overview of the 200 and 300 mm silicon photonics platforms, covering core PIC concepts as well as hands-on design sessions. PREVAIL plays a key role in advancing next‑generation 300 mm silicon photonics technologies, contributing to the development […]
PREVAIL Consortium Meeting
February 2-3, 2026- Leuven, Belgium The PREVAIL Project consortium held its first meeting of 2026 at imec’s HQ in Leuven 🇧🇪 on February 2–3. Partners reviewed key technical progress, including tool installation and qualification, ongoing demo fabrication, updates to the project offering, and preparations for the upcoming training program launching later this year. A productive […]
SEMICON Europa 2025
November 18-21, 2025 – Munich, Germany At SEMICON Europa 2025 in Munich, the Silicon Saxony showcased different institutes from the Fraunhofer Group for Microelectronics (FMD – Forschungsfabrik Mikroelektronik Deutschland). Experts from the Fraunhofer IZM-ASSID were present throughout the event, engaging with visitors and highlighting the infrastructure and capabilities being developed for 3D integration, including access […]
PRESS RELEASE (NEWS!!!!)
November 14, 2025 – Fraunhofer IZM, Dresden, Germany In this PRESS RELEASE, four institutes from the Fraunhofer Microelectronics Group and the Research Factory Microelectronics Germany (FMD) highlight their specific contributions to the range of edge‑AI‑relevant technologies being developed within PREVAIL. They explain how this scientific collaboration strengthens European semiconductor manufacturing capabilities and supports the continent’s […]
PIC Summit Europe 2025
November 4-5, 2025 – Eindhoven, The Netherlands On November 4, 2025, Patrick Vandenameele, CEO-elect at imec, took the stage at PIC Summit Europe 2025 to deliver the plenary keynote “Shaping the Future of the Photonics Industry with Sustainable Innovation.” In his keynote, Patrick outlined how imec is advancing the scaling of integrated photonics and how […]
Edge AI Conference
October 20-22, 2025 – Naples, Italy During the European Conference on EDGE AI – Technologies and Applications (EEAI), our Project Manager Caroline Arnaud (CEA‑Leti) took the stage in the Plenary Session with an energetic and insightful presentation. She highlighted how PREVAIL partners are building a European multi‑hub test and experimentation infrastructure for edge AI hardware, […]
SEMICON WEST 2025
October 7-9, 2025 – Phoenix AZ, USA Our consortium partners Fraunhofer IZM and the Fraunhofer Institute for Photonic Microsystems IPMS were present at the German Pavilion at SEMICON WEST 2025. Among several key advancements, our colleagues Manuela Junghandel, Martin Landgraf, and Frank Windrich highlighted the latest developments in advanced packaging – particularly our 200 mm […]
PREVAIL Consortium Meeting
September 9-10, 2025 – Helsinki, Finland The PREVAIL consortium successfully held its second project meeting of 2025 on September 9 and 10 in Helsinki, generously hosted by VTT. This gathering marked an important milestone for the project, highlighted by the official introduction of Caroline Arnaud as the new Project Manager. Over the two days, partners […]
